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Ultrasonic power features of wire bonding and thermosonic flip chip bonding in microelectronics packaging

✍ Scribed by Li, Jun-hui ;Han, Lei ;Zhong, Jue

Book ID: 107506942
Publisher: Chinese Electronic Periodical Services
Year: 2008
Tongue: English
Weight: 476 KB
Volume: 15
Category: Article
ISSN: 1005-9784
DOI: 10.1007/s11771-008-0127-3

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