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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The influence of heating temperature on alignment precision in thermosonic flip-chip bonding

✍ Scribed by Zhang, Li-na; Han, Lei

Book ID: 120685766
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 861 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4607102

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