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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Ultrasonic features in wire bonding and thermosonic flip chip

✍ Scribed by Junhui Li, ; Lei Han, ; Jue Zhong,

Book ID: 120882267
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 821 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4606954

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