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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo and mechanical study on integrated high-density packaging

✍ Scribed by Qian Chen, ; Yi-ping Wu, ; Feng-shun Wu, ; Zhi-jun Zhu, ; Yuan Tao,

Book ID: 126745052
Publisher: IEEE
Year: 2008
Weight: 624 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4606958

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