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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic mechanical properties of the transparent silicone resin for high power LED packaging

✍ Scribed by Qin Zhang, ; Xiu Mu, ; Kai Wang, ; Zhiyin Gan, ; Xiaobing Luo, ; Sheng Liu,

Book ID: 126651981
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 379 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4607073

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