𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Simulation on thermal characteristics of LED chips for design optimization

✍ Scribed by Ting Cheng, ; Xiaobing Luo, ; Suyi Huang, ; Zhiyin Gan, ; Sheng Liu,

Book ID: 121294770
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 313 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4607030

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Thermo and mechanical study on integrated high-density packaging

✍ Qian Chen, ; Yi-ping Wu, ; Feng-shun Wu, ; Zhi-jun Zhu, ; Yuan Tao, 📂 Article 📅 2008 🏛 IEEE ⚖ 624 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - SiP/SoP technology and its implementation

✍ Lixi Wan, 📂 Article 📅 2008 🏛 IEEE ⚖ 245 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of thermal performance of various power-device packages

✍ Xuejun Fan, 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 304 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Recent progress of ohmic contact on ZnO

✍ Yao Lv, ; Lixi Wan, 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 281 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Simulation of multi-bit digital delta-sigma modulator

✍ Wen-Rong Yang, ; Yuan-Yuan Cheng, ; Jiong-ming Wang, 📂 Article 📅 2008 🏛 IEEE 🌐 English ⚖ 146 KB

[IEEE High Density Packaging (ICEPT-HDP)

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Methodology for modeling simultaneous switching noise in BGA packaging

✍ Song Li, ; Xue-tao Weng, 📂 Article 📅 2008 🏛 IEEE ⚖ 174 KB