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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Study of prepress force on piezoelectric transducer of wire bonding

✍ Scribed by Li zhanhui, ; Wu yunxin, ; Long zhili,

Book ID: 120886903
Publisher: IEEE
Year: 2008
Tongue: English
Weight: 396 KB
Category: Article
ISBN: 1424427398
DOI: 10.1109/ICEPT.2008.4607107

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