Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

✍ Scribed by Fuliang Wang; Yun Chen; Lei Han

• Book ID: 117913311
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2011
• Tongue: English
• Weight: 955 KB
• Volume: 1
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2138703