✦ LIBER ✦
The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces
✍ Scribed by Li Junhui; Wang Ruishan; He Hu; Wang Fuliang; Han Lei; Zhong Jue
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 838 KB
- Volume
- 86
- Category
- Article
- ISSN
- 0167-9317
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