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Observations on HRTEM features of thermosonic flip chip bonding interface

✍ Scribed by Junhui Li; Lei Han; Jue Zhong

Book ID: 113782300
Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 752 KB
Volume: 106
Category: Article
ISSN: 0254-0584
DOI: 10.1016/j.matchemphys.2007.06.034

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