✦ LIBER ✦
Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
✍ Scribed by Cheng-Li Chuang; Qing-An Liao; Hsun-Tien Li; Shi-Jie Liao; Guo-Shing Huang
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 760 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0167-9317
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