Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip–Chip Bonding

✍ Scribed by Li Junhui; Zhang Xiaolong; Liu Linggang; Deng Luhua; Han Lei

• Book ID: 117913352
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2012
• Tongue: English
• Weight: 883 KB
• Volume: 2
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2012.2183601