✦ LIBER ✦
Effects of SU-8 Cross-linking on Flip-Chip Bond Strength when Assembling and Packaging MEMS
✍ Scribed by Nathan E. Glavitz; LaVern A. Starman; Ronald A. Coutu Jr.; Richard L. Johnston
- Book ID
- 119355599
- Publisher
- Elsevier
- Year
- 2011
- Tongue
- English
- Weight
- 558 KB
- Volume
- 25
- Category
- Article
- ISSN
- 1877-7058
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