✦ LIBER ✦

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Comparison of bonding defects for longitudinal and transverse thermosonic flip-chip

✍ Scribed by Leung, M.L.H.; Lai-Wah, H.C.; Chou-Kee, P.L.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 5th Electronics Packaging Technolo

✍ Burga, R.; Tausek, A. 📂 Article 📅 2003 🏛 IEEE ⚖ 274 KB

[IEEE Proceedings of 6th Electronics Pac

✍ Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reichl, H. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 357 KB