[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Process flow and manufacturing concept for embedded active devices

✍ Scribed by Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reichl, H.

• Book ID: 118029707
• Publisher: IEEE
• Year: 2004
• Tongue: English
• Weight: 357 KB
• Volume: 0
• Category: Article
• ISBN-13: 9780780388215
• DOI: 10.1109/eptc.2004.1396679