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[IEEE 2004 54th Electronic Components and Technology Conference - Las Vegas, NV, USA (1-4 June 2004)] 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Reliability of large organic flip-chip packages for industrial temperature environments

✍ Scribed by Bansal, A.; Yuan Li, ; Fritz, D.

Book ID: 111896921
Publisher: IEEE
Year: 2004
Weight: 453 KB
Volume: 0
Category: Article
ISBN-13: 9780780383654
DOI: 10.1109/ectc.2004.1320363

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