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[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Substantiation of numerical analysis methodology for CPU package with non-uniform heat dissipation and heat sink with simplified fin modeling

✍ Scribed by Gektin, V.; Ron Zhang, ; Vogel, M.; Guoping Xu, ; Lee, M.

Book ID: 118026864
Publisher: IEEE
Year: 2004
Weight: 976 KB
Volume: 0
Category: Article
ISBN-13: 9780780383579
DOI: 10.1109/itherm.2004.1319221

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