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[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Multi-layered SiC microchannel heat sinks - modeling and experiment

✍ Scribed by Skandakumaran, P.; Ortega, A.; Jamal-Eddine, T.; Vaidyanathan, R.

Book ID: 121294788
Publisher: IEEE
Year: 2004
Weight: 746 KB
Category: Article
ISBN-13: 9780780383579
DOI: 10.1109/ITHERM.2004.1319196

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