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[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Thermal insulation using fullerenes

✍ Scribed by Wexler, E.M.; Loutfy, R.O.

Book ID: 120273170
Publisher: IEEE
Year: 2004
Weight: 322 KB
Category: Article
ISBN-13: 9780780383579
DOI: 10.1109/ITHERM.2004.1318335

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