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[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - The examination of the drop impact test method

✍ Scribed by Qiang Yu, ; Watanabe, K.; Tsurusawa, T.; Shiratori, M.; Kakino, M.; Fujiwara, N.

Book ID: 121868088
Publisher: IEEE
Year: 2004
Weight: 435 KB
Category: Article
ISBN-13: 9780780383579
DOI: 10.1109/ITHERM.2004.1318302

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