✦ LIBER ✦

Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits

✍ Scribed by Libo Qian; Zhangming Zhu; Yintang Yang

Book ID: 113798400
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 370 KB
Volume: 43
Category: Article
ISSN: 0026-2692
DOI: 10.1016/j.mejo.2011.11.004

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