✦ LIBER ✦
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits
✍ Scribed by A.S. Budiman; H.-A.-S. Shin; B.-J. Kim; S.-H. Hwang; H.-Y. Son; M.-S. Suh; Q.-H. Chung; K.-Y. Byun; N. Tamura; M. Kunz; Y.-C. Joo
- Book ID
- 113800623
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 778 KB
- Volume
- 52
- Category
- Article
- ISSN
- 0026-2714
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