✦ LIBER ✦
Test-wrapper optimisation for embedded cores in through-silicon via-based three-dimensional system on chips
✍ Scribed by Noia, B.; Chakrabarty, K.
- Book ID
- 117809908
- Publisher
- The Institution of Engineering and Technology
- Year
- 2011
- Tongue
- English
- Weight
- 664 KB
- Volume
- 5
- Category
- Article
- ISSN
- 1751-8601
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