✦ LIBER ✦
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits
✍ Scribed by Benjamin Backes; Colin McDonough; Larry Smith; Wei Wang; Robert E. Geer
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 700 KB
- Volume
- 28
- Category
- Article
- ISSN
- 0923-8174
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