Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

✍ Scribed by Teng Wang; Kejll Jeppson; Lilei Ye; Johan Liu

• Book ID: 104593835
• Publisher: John Wiley and Sons
• Year: 2011
• Tongue: English
• Weight: 520 KB
• Volume: 7
• Category: Article
• ISSN: 1613-6810
• DOI: 10.1002/smll.201100615

✦ Synopsis

Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10(-3) Ω cm(2) and 4.5 × 10(-4) Ω cm(2) , respectively.