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Microprocessor system applications and challenges for through-silicon-via-based three-dimensional integration

โœ Scribed by Karnik, T.; Somasekhar, D.; Borkar, S.

Book ID
117809913
Publisher
The Institution of Engineering and Technology
Year
2011
Tongue
English
Weight
740 KB
Volume
5
Category
Article
ISSN
1751-8601

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Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measureme