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Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

โœ Scribed by Katti, G.; Stucchi, M.; De Meyer, K.; Dehaene, W.

Book ID
114619847
Publisher
IEEE
Year
2010
Tongue
English
Weight
554 KB
Volume
57
Category
Article
ISSN
0018-9383

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