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Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

✍ Scribed by Ioannis Savidis; Syed M. Alam; Ankur Jain; Scott Pozder; Robert E. Jones; Ritwik Chatterjee

Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 541 KB
Volume: 41
Category: Article
ISSN: 0026-2692
DOI: 10.1016/j.mejo.2009.10.006

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