RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

✍ Scribed by L. Cadix; C. Bermond; C. Fuchs; A. Farcy; P. Leduc; L. DiCioccio; M. Assous; M. Rousseau; F. Lorut; L.L. Chapelon; B. Flechet; N. Sillon; P. Ancey

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 593 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.08.026