Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias

✍ Scribed by C.L. Chen; D.-R. Yost; J.M. Knecht; J. Wey; D.C. Chapman; D.C. Oakley; A.M. Soares; L.J. Mahoney; J.P. Donnelly; C.K. Chen; V. Suntharalingam; R. Berger; W. Hu; B.D. Wheeler; C.L. Keast; D.C. Shaver

• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 958 KB
• Volume: 88
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2010.09.020