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Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

✍ Scribed by En-Xiao Liu; Er-Ping Li; Wei-Bin Ewe; Hui Min Lee; Teck Guan Lim; Shan Gao

Book ID: 114661375
Publisher: IEEE
Year: 2011
Tongue: English
Weight: 715 KB
Volume: 59
Category: Article
ISSN: 0018-9480
DOI: 10.1109/tmtt.2011.2116039

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## Abstract This article presents a full‐wave electromagnetic approach for analyzing the electrical performance of massively coupled through silicon vias (TSV). The TSVs are modeled with SiO~2~ insulation coating and are placed in the sandwiched SiO~2~‐Si‐SiO~2~ substrate. The planar guided wave is