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A Compact Analytic Model of the Strain Field Induced by Through Silicon Vias

✍ Scribed by Sun-Rong Jan; Tien-Pei Chou; Che-Yu Yeh; Chee Wee Liu; Goldstein, R.V.; Gorodtsov, V.A.; Shushpannikov, P.S.


Book ID
114620846
Publisher
IEEE
Year
2012
Tongue
English
Weight
850 KB
Volume
59
Category
Article
ISSN
0018-9383

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