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A Fully Analytical Model for the Series Impedance of Through-Silicon Vias With Consideration of Substrate Effects and Coupling With Horizontal Interconnects
✍ Scribed by Chuan Xu; Kourkoulos, V.; Suaya, R.; Banerjee, K.
- Book ID
- 114620662
- Publisher
- IEEE
- Year
- 2011
- Tongue
- English
- Weight
- 938 KB
- Volume
- 58
- Category
- Article
- ISSN
- 0018-9383
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