✦ LIBER ✦
Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process
✍ Scribed by Chao-Wei Tang; Kuan-Ming Li; Hong-Tsu Young
- Book ID
- 117813482
- Publisher
- The Institution of Engineering and Technology
- Year
- 2012
- Tongue
- English
- Weight
- 198 KB
- Volume
- 7
- Category
- Article
- ISSN
- 1750-0443
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