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Tungsten Through-Silicon Via Technology for Three-Dimensional LSIs

โœ Scribed by Kikuchi, Hirokazu; Yamada, Yusuke; Ali, Atif Mossad; Liang, Jun; Fukushima, Takafumi; Tanaka, Tetsu; Koyanagi, Mitsumasa

Book ID
111902673
Publisher
Institute of Pure and Applied Physics
Year
2008
Tongue
English
Weight
700 KB
Volume
47
Category
Article
ISSN
0021-4922

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Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measureme