✦ LIBER ✦
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures
✍ Scribed by Y. Yang; R. Labie; F. Ling; C. Zhao; A. Radisic; J. Van Olmen; Y. Travaly; B. Verlinden; I. De Wolf
- Book ID
- 108210878
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 677 KB
- Volume
- 50
- Category
- Article
- ISSN
- 0026-2714
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