✦ LIBER ✦
Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias
✍ Scribed by Kwang-Yong Lee; Teck-Su Oh; Jae-Ho Lee; Tae-Sung Oh
- Book ID
- 107453537
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 364 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.