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Studies on electron beam evaporated ZrO2/AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors

✍ Scribed by Balachander, Krishnan ;Arulkumaran, Subramaniam ;Ishikawa, Hiroyasu ;Baskar, Krishnan ;Egawa, Takashi


Book ID
105362955
Publisher
John Wiley and Sons
Year
2005
Tongue
English
Weight
249 KB
Volume
202
Category
Article
ISSN
0031-8965

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✦ Synopsis


Abstract

Metal–oxide–semiconductor high‐electron‐mobility transistors were demonstrated on AlGaN/GaN with electron beam (EB) evaporated ZrO~2~. The composition of the EB deposited ZrO~2~ thin films was confirmed using X‐ray photoelectron spectroscopy (XPS). The fabricated ZrO~2~‐based MOSHEMTs exhibited high positive gate voltage of operation up to +7 V with low gate leakage current. For a comparison, conventional high‐electron‐mobility transistors (HEMTs) were also fabricated with identical device dimensions. The maximum drain current densities of 1168 and 538 mA/mm were observed on MOSHEMTs and HEMTs, respectively. Low gate leakage current density of four orders of magnitude was observed on ZrO~2~‐based MOSHEMTs when compared with the conventional HEMTs. The observation of high forward on‐voltage with low gate leakage current density and high positive operational voltage reveals the importance of ZrO~2~ dielectric films for MOSHEMT devices. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)


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## Abstract We report on the fabrication of AlGaN/GaN double‐insulator MOSHEMTs using SiO~2~ and SiN as the prime gate insulators. Both the dielectrics showed enhanced saturation current density and pinch‐off voltage compared to conventional HEMTs. The SiO~2~/SiN/AlGaN/GaN MOSHEMTs exhibited a low