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RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration

✍ Scribed by Lamy, Y.P.R.; Jinesh, K.B.; Roozeboom, F.; Gravesteijn, D.J.; Besling, W.F.A.

No coin nor oath required. For personal study only.

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