✦ LIBER ✦
Moving Boundary Simulation and Experimental Verification of High Aspect-Ratio Through-Silicon-Vias for 3-D Integration
✍ Scribed by Chongshen Song; Zheyao Wang; Zhimin Tan; Litian Liu
- Book ID
- 117913317
- Publisher
- Institute of Electrical and Electronics Engineers
- Year
- 2012
- Tongue
- English
- Weight
- 975 KB
- Volume
- 2
- Category
- Article
- ISSN
- 2156-3950
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