The implementation of a new model to simulate the oxidation of Silicon (see Part I) is presented in this paper. The implementation is done within a "nite element framework. The work involves representation of the Silicon}Silicon dioxide interface in a mesh-independent manner. The interface descripti
On modelling thermal oxidation of Silicon I: theory
β Scribed by Vinay S. Rao; Thomas J. R. Hughes
- Publisher
- John Wiley and Sons
- Year
- 2000
- Tongue
- English
- Weight
- 152 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0029-5981
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β¦ Synopsis
This work focuses on a new mathematical framework to model the process of thermal oxidation in silicon. The mathematical model is derived from the fundamental conservation equations of mechanics. The mass balance law provides the description of the oxidant transport and the Si}SiO interface motion, and momentum balance provides the framework to model the displacements and stresses in the bulk and the oxide. The displacements de"ne the geometry of the "nal oxide structure. The large expansion is treated within a mathematically exact formulation following a split of the deformation gradient. A thermodynamically consistent constitutive equation for silicon dioxide is suggested to represent recent experimental data.
π SIMILAR VOLUMES
Recent advances are presented in the models for thermal oxidation that have been been introduced by Rao and co-workers. The level-set formulation for movement of the Si-SiO 2 interface has been improved by the application of an efficient velocityprojection scheme for noninterface points. A penalty f
## Influence of Mechanical Stress on Thermal Oxidation Phenomena of Silicon Some phenomena of the thermal wet oxidation of polycrystalline silicon structures are discussed in connection with the geometry of this structures and mechanical stress present in the growing oxide layer. A model is presen
## Abstract This paper describes the application of the boundary element method to solving twoβdimensional steady slow viscous flow problems (creeping flow) in thermal silicon oxidation. The proposed method used the velocityβpressure formulation. The use of the incompressibility condition as a boun