๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Low temperature epoxy bonding for wafer level MEMS packaging

โœ Scribed by Yong-Kook Kim; Eun-Kyung Kim; Soo-Won Kim; Byeong-Kwon Ju

Book ID
108262930
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
805 KB
Volume
143
Category
Article
ISSN
0924-4247

No coin nor oath required. For personal study only.

๐Ÿ“œ SIMILAR VOLUMES

Low-temperature wafer bonding for MEMS p
Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns
โœ S. Ishizuka; N. Akiyama; T. Ogashiwa; T. Nishimori; H. Ishida; S. Shoji; J. Mizu ๐Ÿ“‚ Article ๐Ÿ“… 2011 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 749 KB

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 lm were formed on wafers by means of screen-printing. The bonding process was carried out at 300 ยฐC under reduced pressure,