Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns
✍ Scribed by S. Ishizuka; N. Akiyama; T. Ogashiwa; T. Nishimori; H. Ishida; S. Shoji; J. Mizuno
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 749 KB
- Volume
- 88
- Category
- Article
- ISSN
- 0167-9317
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✦ Synopsis
In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50 lm were formed on wafers by means of screen-printing. The bonding process was carried out at 300 °C under reduced pressure, 1  10 À3 mbar. The bonded wafers were diced into 5 mm  5 mm individual chips. The bond strength of each chips was about 20 MPa measured by a tensile test and about 40 MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.