✦ LIBER ✦
High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
✍ Scribed by C.-J. Lin; M.-T. Lin; S.-P. Wu; F.-G. Tseng
- Book ID
- 106184687
- Publisher
- Springer-Verlag
- Year
- 2004
- Tongue
- English
- Weight
- 447 KB
- Volume
- 10
- Category
- Article
- ISSN
- 0946-7076
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