Glass frit bonding: an universal technology for wafer level encapsulation and packaging

✍ Scribed by Roy Knechtel

• Book ID: 106184811
• Publisher: Springer-Verlag
• Year: 2005
• Tongue: English
• Weight: 479 KB
• Volume: 12
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-005-0022-x