Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems

✍ Scribed by Yi Tao; Ajay P Malshe; William D Brown

• Book ID: 108361990
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 422 KB
• Volume: 44
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(03)00192-6