✦ LIBER ✦
Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition
✍ Scribed by L. Mele; B. Morana; C. de Boer; J.F. Creemer; P.M. Sarro
- Book ID
- 108254954
- Publisher
- Elsevier
- Year
- 2009
- Weight
- 228 KB
- Volume
- 1
- Category
- Article
- ISSN
- 1876-6196
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