✦ LIBER ✦
Wafer-level plasma activated bonding: new technology for MEMS fabrication
✍ Scribed by Viorel Dragoi; Gerald Mittendorfer; Christine Thanner; Paul Lindner
- Book ID
- 106185334
- Publisher
- Springer-Verlag
- Year
- 2007
- Tongue
- English
- Weight
- 298 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0946-7076
No coin nor oath required. For personal study only.