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Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing

✍ Scribed by Xiaoyan Liu; Yuling Liu; Yan Liang; Zhiwen Zhao; Baohong Gao


Book ID
113797913
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
504 KB
Volume
91
Category
Article
ISSN
0167-9317

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