An empirical approach to explain the material removal rate for copper chemical mechanical polishing

✍ Scribed by Pan Guoshun; Wang Ning; Gong Hua; Liu Yan

• Book ID: 113936168
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 365 KB
• Volume: 47
• Category: Article
• ISSN: 0301-679X
• DOI: 10.1016/j.triboint.2011.10.010